SPV-12Z online chip vacuum plasma cleaner is a dedicated RF online chip vacuum cleaner for the semiconductor industry, with a cleaning uniformity of 5% and a pass rate of 100%, ensuring that the product does not change color.
working principle
Plasma surface treatment is to ionize the gas into plasma by applying sufficient energy to it. The "active" components of plasma include: ions, electrons, atoms, active genes, etc. Plasma treatment is to use the properties of these active components to treat the surface of the sample, so as to achieve cleaning, modification, etching and other purposes. The structure of the online chip vacuum plasma cleaning machine is mainly divided into five components: control system, excitation power system, vacuum chamber, process gas system, and vacuum pump system. （A）Control System:The role of the control system is to control the operation of the entire on-line vacuum plasma cleaning equipment and the protection of the overall system. （B）Excitation power system:The generation of plasma requires high voltage excitation, and the online chip vacuum plasma adopts RF power supply, power 0-600W, frequency 13.56MHZ. （C）Vacuum cavity:The vacuum chamber is made of aluminum alloy (stainless steel chamber can be customized) （D）Process gas system:Standard two-way process gas, argon/oxygen (can be customized) （E）Vacuum pump system:The vacuum pump group adopts oil pump, and the vacuum pumping speed is one of the important factors to determine the working efficiency of a vacuum plasma cleaning machine. The speed of vacuum pumping mainly depends on the vacuum pump.
Industry-specific solutions
Semiconductor industry application Die attach pretreatment:Remove contaminants on the surface of materials, increase surface wettability, improve colloid fluidity, and ensure binding ability with other materials. Before plastic sealing:Remove contaminants on the surface of the material, so that the surface of the chip and the plastic packaging material are firmly combined, and the occurrence of delamination and air bubbles is reduced. Metal bonding pretreatment:Removes organic contamination from metal pads, improving the strength and reliability of the soldering process.
