Maximum product size               4-12 inch wafers or products that support up to 300*300mm, compatible with wafers 12 inches and below
	temperature range                     Room temperature ~1250℃
	Temperature control method                     Fast PID temperature control
	temperature uniformity                 Temperature uniformity at <500℃:±5℃, Temperature uniformity at>500℃:±1%
	Maximum heating rate               ≤25℃/s(SiC carrier disc)