PCB production and processing technology process
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open material
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inner layer dry film
Plasma cleaning
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browning
Plasma cleaning
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laminated
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drilling Plasma cleaning
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Immersion copper plate plating
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Outer layer dry film
Plasma cleaning
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Outer graphic plating
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Solder mask
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Final inspection, random testing, packaging
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Electrical test
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molding
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surface treatment
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silk screen characters
Plasma cleaning
PCB drilling and glue removal plasma cleaning
Plasma cleaning PCB drilling and degumming is generally divided into three steps, including preheating, degumming, and cleaning. According to the needs of the process, there will be more than three stages of processing.
In the first stage, high-purity nitrogen gas is used to generate plasma, and at the same time, the PCB is preheated to make the polymer material in a certain activated state. Temperature is the key at this stage.
In the second stage, oxygen and tetrafluoride are mixed to generate oxygen and fluorine plasma, which react with acrylic acid, glue residue, glass fiber, etc. to achieve the purpose of decontamination and glue removal. The gas ratio is the key at this stage.
In the third stage, oxygen is used as the original gas to generate plasma and reaction residues to clean the pore walls. During the plasma cleaning process, in addition to the plasma reaction chemical reaction, the plasma also physically reacts with the surface of the material, and the plasma particles clean the surface of the material. The atoms or the atoms attached to the surface of the material are destroyed to achieve the cleaning effect.
Factors Affecting the Cleaning of Plasma Cleaning Equipment Plasma cleaning is highly sensitive to degumming, and its cleaning effect is easily affected by many factors. It should be discussed from the factors brought by the PCB itself, process parameters and plasma cleaning machine. The PCB itself includes drill quality, hole distribution and size, substrate moisture level and temperature. The process parameters mainly include gas ratio, flow rate, radio frequency power, vacuum degree, temperature and processing time. In practical applications, when the process parameters are set and the quality of the PCB itself is relatively stable, then whether the production conditions reach the set value and the high-quality glue removal effect depends on the operation of the plasma cleaning equipment. The good state of the plasma equipment should be the premise to ensure the removal of glue and decontamination.
Plasma technology is mainly used as an important means to deal with drilling residues in the printed circuit board industry.
