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SDC-580Fully automatic wafer contact angle measuring instrument

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SDC-580列表图片.png

SDC-580Fully automatic wafer contact angle measuring instrument

Wafer contact angle testing equipment tailored for wafer customers, which can meet multi-point testing of 6-12 inch wafer samples.

Equipment overall parameters
ModelSDC-580 Types ofFully automatic wafer type weight55kg
Specification(L*W*H) 1100*600*670mm Material of baseAviation aluminum
Sample platform system
Experimental platform320mm*320mm Platform moveautomatic
Platform movement range 160mm*20mm Platform tiltManual tilting platform (optional)Electric tilting platform (optional)
Acquisition System
CameraU3.0 Type of lensHigh Fidelity Microscope Lens
Lens magnification6.4 times zoom±5mm
Maximum shooting speed2500 frames/s more models optional Front and rear adjustment of the lens30mm
Lens tilt adjustment±10°
Injection system
Drop sampleAutomatic aspiration and injection Wetting liquidFully automatic wetted
Dripping accuracy0.01 μL scalable picoliter system Liquid injection movement methodManual (upgradeable to automatic)
Liquid injection movement stroke60mm*60mm Injection controlSoftware Digitization
Light source system
Light sourceFocus LED Wavelength450-480nm
Test function
Contact angle analysis (complete set)
Surface free energy analysisZisman、OWRK、WU、WU 2、Fowkes、Antonow、Berthelot、EOS、Adhesion work, wetting work, spreading coefficient
Surface interfacial tension Forward/Backward angle
Roll slip angle Dynamic Video Measurement
Injection percentage Sloping form--
Captive bubble method Top view measurement
3D formoptional Temperature control platformoptional
Video shooting Online measurement
Analysis method Three-phase automatic Data export
Programming test Morphology spectrum
Fuzzy topography measurement Batch sessile drop method
SoftwareContact angle V3/V5

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