The plasma state is the fourth state of matter, which can be ionized into plasma by applying an electric field to the process gas. Plasma cleaning is to use the properties of these active components to change the surface properties of samples by physical and chemical reactions such as oxidation, reduction, cracking, cross-linking and polymerization, so as to optimize the surface properties of materials and achieve cleaning, modification, etching and other purposes.
Plasma cleaning is called dry cleaning, which is different from cleaning as the public knows. The cleaning process is an environmentally safe process and does not involve harsh chemicals. The plasma leaves free radicals on the surface of the material, thereby increasing the adhesion of that surface.
Plasma cleaners are safe, green and efficient plasma cleaning methods. Material surface contamination removal can be performed without affecting material properties. It can be widely used in the removal of dirt left in the PCB board packaging process. In addition, plasma cleaning machines are used in 6C, FPD display, LED, and semiconductor industries, and are the key technology to improve product quality.
Plasma cleaning is an emerging field that combines plasma physics, chemistry, and chemical reactions at the gas-solid interface. Across a variety of fields, including chemicals, materials and electrical machinery. Therefore, it will be extremely challenging and full of opportunities. With the rapid development of the new energy industry and the semiconductor industry, the application demand in this area will become larger and larger.