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Application of Contact Angle Measuring Instrument in Semiconductor Wafer Industry

2022-04-02

Since Huawei's chips were affected by the US sanctions, China has increased its research and development efforts in the chip industry, which has promoted the rapid development of the entire semiconductor chip industry. We all know that the semiconductor chip industry, especially the manufacturing of wafers, has very high requirements for cleanliness. Only wafers that meet the requirements can produce high-end precision chips.


晟鼎精密晶圆接触角测量仪测量

Sindin Precision Wafer Contact Angle Measuring Instrument

Sindin Precision Wafer Contact Angle Measuring Instrument SDC-580


晟鼎精密晶圆接触角测量仪SDC-580


The application of the contact angle measuring instrument requires that the droplets can be sharply captured. The droplet precision of the SDC-580 precision wafer contact angle measuring instrument can reach 0.01 μL (upgradable picoliter), which is specially designed for wafer Wafer customers. A set of automatic wafer contact angle testing equipment built by ourselves, matrix multi-point testing, accurate and convenient, can meet the multi-point testing of 6-12 inch wafer samples at the same time, can measure more than 50 points at one time, and can One-click export of data map, which is widely used in the study of the wettability of wafer materials.


Industry application

Measure the wetting behavior of liquid on the surface of wafer material, such as spreading, penetration, absorption, etc., measure static and dynamic contact angle, measure and analyze the surface free energy of solid, interface and surface tension of liquid, fully automatic injection system, advancing and retreating angle, rolling angle and other comprehensive functions.


Measurement methods

接触角测量仪测量方法

Measurement function

接触角测量仪测量功能

Fitting method

接触角测量仪拟合方法

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