Application of Microwave Plasma Cleaner in Semiconductor Chip Packaging
In the semiconductor packaging process, due to the special requirements of product precision, higher requirements are put forward for the performance of plasma cleaning equipment. Shengding precision microwave plasma cleaning machine is mainly aimed at the research and development of semiconductor packaging process. Let's take a look at the advantages of microwave plasma cleaning machine in semiconductor packaging.
√ The equipment and fixture is flexible and can adapt to the irregular product demand.
√ Electrodeless microwave design can meet the processing needs of soft products.
√ Electrically neutral plasma, no electrical damage to the product.
√ Equipped with magnetic fluid rotating frame to increase the uniformity of PLASMA processing.
Application range of Sindin Microwave Plasma Cleaner in Chip Packaging process Section
Surface cleaning before chip bonding：
Improve the wettability between the chip and the substrate and remove the oxide film, so as to improve the bonding effect and improve the product quality;
Surface cleaning before eutectic welding:
Remove the impurities on the substrate and the oxide film on the solder, thereby reducing the formation of eutectic voids and improving the reliability and yield of eutectic products;
Pre-processing of wire bonding:
It can effectively remove the photoresist in the bonding zone, the oxide film of the lead frame and the organic pollutants in the manufacturing process, so as to improve the bonding strength and reduce the bonding separation;
Surface treatment before plastic packaging of the chip:
Improve the wettability of the material surface, reduce the package gap, and enhance its electrical performance;
In short, in the semiconductor chip packaging process, chip bonding / eutectic "lead welding" packaging Mark and other process links, are recommended to use Shengding microwave PLASMA cleaning machine, lossless precision devices, does not affect the process performance, and helps to effectively improve the quality of chip packaging.