working principle
Microwave plasma cleaning is a process in which plasma is used to chemically or physically treat the surface of the workpiece at the molecular level to remove contamination and improve surface performance. Corresponding to different pollutants, different cleaning processes should be used. When the pressure in the cavity is in dynamic equilibrium, the high-frequency alternating electromagnetic field generated by the oscillation of the microwave source ionizes the process gases such as argon, oxygen, nitrogen, and hydrogen to generate plasma, and the active plasma carries out physical bombardment and chemical bombardment of the cleaned objects Redox reactions.
The structure of the microwave plasma cleaning machine is mainly divided into four major components: control system, vacuum chamber, process gas system, and metal hollow conduit.
Industry-specific solutions
Semiconductor industry application
Die attach pretreatment:Remove contaminants on the surface of materials, increase surface wettability, improve colloid fluidity, and ensure binding ability with other materials.
Before plastic sealing:Remove contaminants on the surface of the material, make the chip surface and the plastic packaging material firmly bonded, and reduce the generation of delamination and air bubbles.
Photoresist Removal:Remove residual photoresist and other organics, activate and roughen wafer surface, and improve wafer surface wettability.
Metal bonding pretreatment:Removes organic contamination from metal pads, improving the strength and reliability of the soldering process.
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