Industry-specific solutions
Electronic circuit industry application
HDI board:After laser drilling, plasma cleaning is performed to remove carbides, etch and activate via holes to improve the yield and reliability of the PHT process.
FPC board:It can effectively remove the resin residue on the hole wall of the multi-layer flexible board, increase the surface roughness, improve the surface wettability, and increase the quality of welding and dispensing.
Rigid-flex board:Removes debris inside the perforations and improves surface adhesion.
Teflon board:Clean and activate the hole wall and the material surface to improve the bonding force between the hole wall and the copper-plated layer, and improve the adhesion between the solder mask ink and the silk screen characters.
BGA placement：Clean and activate the Pad surface to improve the yield of BGA placement.
HDI board:After laser drilling, plasma cleaning is performed to remove carbides, etch and activate via holes to improve the yield and reliability of the PHT process.
FPC board:It can effectively remove the resin residue on the hole wall of the multi-layer flexible board, increase the surface roughness, improve the surface wettability, and increase the quality of welding and dispensing.
Rigid-flex board:Removes debris inside the perforations and improves surface adhesion.
Teflon board:Clean and activate the hole wall and the material surface to improve the bonding force between the hole wall and the copper-plated layer, and improve the adhesion between the solder mask ink and the silk screen characters.
BGA placement：Clean and activate the Pad surface to improve the yield of BGA placement.
