HDI board:After laser drilling, plasma cleaning is performed to remove carbides, etch and activate via holes to improve the yield and reliability of the PHT process.
FPC board:It can effectively remove the resin residue on the hole wall of the multi-layer flexible board, increase the surface roughness, improve the surface wettability, and increase the quality of welding and dispensing.
Rigid-flex board:Removes debris inside the perforations and improves surface adhesion.
Teflon board:Clean and activate the hole wall and the material surface to improve the bonding force between the hole wall and the copper-plated layer, and improve the adhesion between the solder mask ink and the silk screen characters.
BGA placement:Clean and activate the Pad surface to improve the yield of BGA placement.